Description
SCS7* is Asahi€™s latest lead free alloy development. As an enhanced tin/copper lead free alloy, it is highly recommended to directly replace existing SnCu0.7 solder. This alloy not only exhibits the excellent ductility of SnCu0.7 solder, it also possesses superior mechanical strength both in ambient and high temperature environments. SCS7€™s fatigue resistance is now comparable to tin/lead solder and as such, SCS7 has addressed the fundamental concerns of SnCu alloys.
SCS7 CLF5160 lead free no clean core flux solder wire is formulated using purest raw chemicals, which guarantees absolute flux core continuity and consistency in solder properties. It provides excellent instant wetting action and superior solderability on a variety of surface finishes. There are a few options of flux content catered for your specific requirement, ranging from 2.0 to 3.0 ± 0.3 wt%.
Technical Details
- Alloy Composition: Sn/Cu0.7/Si0.02
- Flux Content: 2.0 ~ 4.0 ± 0.3 wt%
- Halide Content: Not Added
- Water Extract Resistivity: > 1 x 10µ Ω-cm
- Surface Insulation Resistance, Electromigration: > 1 x 10€Ž¸ Ω
- Copper Corrosion Test: Pass
- Copper Mirror Test: Classified as €œL€, Pass
- Flux Activity Classification: ROL0
- Spread Factor: > 75% (SCS7)
- Residue Dryness Test: Pass
- Residue Appearance: Light Yellowish
PHYSICAL PROPERTIES
- Melting Temperature: 227 °C
- Coefficient of Thermal Expansion: 22.7 μm/m°C
- Density: 7.30 g/cm³
Shipping List
- 1x Solder 1mm 1kg